Distributed Power Harvesting System : Solar Edge Technology

SolarEdge three-fold architecture consists of PowerBoxes T performing module-level MPPT, a highly reliable inverter , and a web portal for module-level monitoring and fault detection. The PowerBox is embedded into each module by module-manufacturers instead of the junction box, or retrofitted by PV installers onto c-Si, Thin film and CPV modules. The system features the following technological advancements:

Module-level MPPT
A highly-optimized algorithm ensures each module is kept in MPP preventing power loss even in panel mismatch or partial shading conditions.  Module-level MPPT is faster than tracking done at the inverter allowing it to better follow changes in sun irradiance, ensuring that no power is lost on partially cloudy days when changes in irradiance are frequent and fast.

Highly efficient DC conversion
Each PowerBox employs DC-DC conversion allowing it to either Boost or Buck the output voltage of the module without changing the output power. The DC conversion is done extremely efficiently with peak efficiency above 98%.

Fixed String Voltage
One of SolarEdge's breakthroughs! The PowerBoxes collaborate to maintain the string voltage fixed at the optimal DC to AC inversion point of the inverter, regardless of the number of modules in a string, their performance, or environmental conditions. The fixed string voltage gives rise to flexible site design, temperature indifference, optimal inverter efficiency and reduced installation cost.

Advanced Power-Line-Communication
All PowerBoxes continuously measure and communicate a range of module-specific status indicators.  SolarEdge communication is transmitted from the PowerBoxes to the inverter over the existing DC power lines (PLC), eliminating the need for additional wiring. In the inverter, integrated Ethernet enables easy broadband connection to a remote monitoring server.

ASIC Technology
One key factor in increasing the efficiency and overall reliability of the PowerBox is the elimination of discrete components and their integration into two Application Specific Integrated Circuits (ASICs): The high-voltage, high-current, analog blocks are implemented in a high-voltage Silicon-On-Insulator (SOI) process, geared specifically for the harsh-environment automotive industry. The logic-based digital blocks are implemented in a mature, extremely high yield process developed by the world's largest semiconductor fabrication plant.